Akrometrix - Automated Flatness Inspection

The new generation of surface measurement and analysis techniques

Development/Diagnostics /Production Monitoring. Whether your customer is the individual consumer or an OEM, the TherMoiré excels at helping you achieve exceptional customer satisfaction. Better than ever, TherMoiré technology can simulate your thermal processing and operating environment conditions, while capturing a complete history of out-of-plane displacement behavior. Applying this critical information to form - or achieve compliance for - component/substrate behavior allowances (i.e. warpage specifications) can directly impact level I & level II assembly yields and enhance product reliability. Below data could be measured: Coplanarity, Sign warpage, Fulfill warpage, Twist, Bow, CTE, etc.

Press Release:

• Advanced Second Level Assembly Analysis Techniques - Ken Chiavone's Global SMT & Packaging Article 

• NEW!!! Press Release (Jan-20-2014) - The CXP for Cost-effective Elevated Temperature Surface Characterization^TM 

• NEW!!! Press Release (Jan-16-2014) - The Convection Reflo Emulation Module (CRE) for Next Generation Reflow Emulation Combined with Surface Characterization^TM 

Product Applications:

• Introduction to High Volume Testing Protocol with Part Tracking^TM  / Applications

• High Volume Testing Protocol/Best Practices  / Applications 

• Die and Package Testing Protocol/Best Practices  / Applications

• PCB Testing Protocol/Best Practices  / Applications

• Socket Testing Protocol Summary  / Applications

Table Top Shadow Moiré (TTSM)
For fast, room temperature warpage metrology

Shadow Moiré is a non-contact, full-field optical technique that uses geometric interference between a reference grating and its shadow on a sample to measure relative vertical displacement at each pixel position in the resulting image. It requires a Ronchi-ruled grating, a white line light source at approximately 45 degrees to the grating and a camera perpendicular to the grating. Its optical configuration integrated with the heating chamber is shown in the figure below. A technique, known as phase stepping, is applied to shadow moiré to increase measurement resolution and provide automatic ordering of the interference fringes. This technique is implemented by vertically translating the sample relative to the grating.

Thermal Shadow Moire to Cross-section Correlation Study

• Max measure area 400mm x 400mm

• Dynamic Temperature Profilling-temperature range from -55°C  to 300°C

• Support the simulation of the reflow oven temperature from  room temperature to 300°C

• Maximum heat 2 degrees Celsius per second

• Modular Metrology - Shadow Moiré, Digital Image Correlation,    Micro Fringe Projection

• Automated Analyses - Bow, Twist, Coplanarity, Chamber, CTE,     Surface Tilt, etc

• Data Management - Centralized database tools for production     monitoring, trending and customer conformity/assurance     requirements.

• Support multi-sample test at the same time, increase production

PCB

Socket

QFN (3mm x 3mm)

• Enables step height and discontinuous surface measurement

• FOV can be moved to anywhere on the sample (gantry fixture)

• Improved top/bottom temperature uniformity – no grating

• High X/Y resolution for solder ball coplanarity measurement

• Maximum FOV – 48mm x 64mm

• Maximum Sample Size – 300mm x 300mm

• Minimum Sample Size - .5mm x .5mm

• Resolution, Z-axis – 5 microns

• Accuracy, Z-axis – 5 microns

Enables step height and discontinuous
surface measurement

• Specifically designed for the FOWLP market

• Utilizes shadow moiré to measure warpage, down to 1.25µm in z-resolution
• Full Field of View, Single Shot metrology in less than 2 seconds
• Able to accommodate panels up to 600mm x 600mm
• Can also accommodate wafers - perfect bridge tool
• Optional oven to measure warpage in temperatures ranging from 26°C to 300°C

Fan Out Wafer Level Processing (FOWLP)

• Add-on Module to: AXP & PS200S

• Strain and CTE measurement module

• Data acquisition time < 1 second

• In-Plane Resolution: < 1.0 μm

• Strain Resolution: < 150 microstrain (Δ L/L x 10^-6)

• Temperature Range: 26°C to 300°C

• Field of Views: 75 mm x 75 mm

DIC 2.0 Module installed

in the TherMoiré AXP

Mean strain values used

for CTE calculation

Akrometrix Studio 8.3.2 Software

Trouble Shooting & Assembly Defects?

* HNP/H0P
* SHORTS
* OPENS

Combines maximum resolution capabilities of the AXP with the ability to measure discontinuous surfaces

• Convection heating and cooling

• Temperature uniformity consistent with Production/Assembly    convection reflow ovens

• Submicron resolution capabilities/ multi-part testing

• Field of View (FOV) – 75mm Circle

• Enables user-defined ‘Pass/Fail’ limits applied to measurement results

• Visual Pass/Fail indicators immediately after measurement

• Works with Part Tracking for Multiple Part Testing

• Works at Room Temperature and During Thermal Profile